CPO Chip, BGA

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Product Detail

Key Features

Support 2 style of DUT feeding – magazine mode, and conveyor JEDEC pallet mode
Repair mode support – manual material loading from back side
Modular design – AOI cell and material feeding cell, isolate interference to vision inspection. Easy to reuse the core module, and configure with different loading cell
Vibration Isolation - compliant with VC-C Standard
MSG Laser Auto Fucus
High accuracy marble platform
Plasma cleaning integrated (can be replaced with other cleaning method)
Support manual operation mode
Programmable AOI and cleaning process
Serviceability – convenient with side doors
Class 6 clean room supported
Auto gripper exchange – vacuum grippe for OE and CPO Chip

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Product Detail

Key Features

Support 2 style of DUT feeding – magazine mode, and conveyor JEDEC pallet mode
Repair mode support – manual material loading from back side
Modular design – AOI cell and material feeding cell, isolate interference to vision inspection. Easy to reuse the core module, and configure with different loading cell
Vibration Isolation - compliant with VC-C Standard
MSG Laser Auto Fucus
High accuracy marble platform
Plasma cleaning integrated (can be replaced with other cleaning method)
Support manual operation mode
Programmable AOI and cleaning process
Serviceability – convenient with side doors
Class 6 clean room supported
Auto gripper exchange – vacuum grippe for OE and CPO Chip

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